Ngomhla zingama-26 kuNdasa, 2023, i-Hangzhou Hanpai Mold Technology Co., Ltd. imeme uSolwazi Ling Guoping waseSikoleni Sezinto Sezisetshenziswa sase-Zhejiang University, u-Shen Liang, unjiniyela omkhulu we-Hangzhou Institute of Mechanical Science, u-Fang Jianjun, iphini lomphathi jikelele we-Liyang Jinkun Forging kanye no-Yan Laiping, unjiniyela omkhulu, kanye no-Wang Yonglai, unjiniyela wenkampani yethu babambe iqhaza kwisemina yobuchwepheshe be-ring die.Emhlanganweni, ochwepheshe benza ukuqonda okuphelele kwe-ring die forging to production heat treatment, bahlaziya izingozi ezingaba khona ezicashile kule nqubo, futhi benza izingxoxo ezijulile ngokuhluleka kokufa kweringi, kanye nezinhlelo ezihlongozwayo zokuthuthukisa kanye nokwenza kahle.
Isikhathi sokuthumela: Mar-27-2023